High-density design
Printed circuit board design adapted to semiconductor package forms with advancing narrow pitch.
We propose the optimal printed circuit board design and manufacturing based on the packages used.
- Company：ピーダブルビー 草津事業所
- Price：Other
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Support for high-density design
Achieving miniaturization, high density, and high reliability with flex-rigid integration!
Our company generates many benefits through integrated flex-rigid technology. We solve issues such as "high initial costs that prevent prototyping" and "the desire to ensure high reliability." Flex-rigid substrates contribute to miniaturization and high-density design without connectors, reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction for molds through router processing ■ Multi-layer structure possible for flex layers ■ Use of liquid crystal polymer materials for flex layers Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
